At the Hot Chips 2024 event hosted by Stanford University, Intel unveiled its latest innovations including new processors and a novel interconnect technology. The highlight was the introduction of the Xeon 6 SoC, which incorporates an advanced optical interconnect specifically designed for accelerated AI data processing.
Although the initial details of the Xeon 6 were previously released, further insights were shared about the Granite Rapids-D variant, expected to debut in the first half of 2025. This variant is specially tailored for scalable single-system architectures ranging from edge devices to edge nodes, integrating AI accelerators directly.
The Xeon 6 SoC merges a compute chiplet from the Xeon 6 series with an I/O chiplet optimized for edge applications. This integration purportedly boosts performance, energy efficiency, and transistor density over earlier models. According to Intel, Granite Rapids-D is engineered using data gathered from over 90,000 edge implementations. It supports up to 32 lanes of PCI Express 5.0, up to 16 lanes of Compute Express Link (CXL) 2.0, and dual 100G Ethernet connections.
Enhancements focused on edge computing include broader operating temperature capabilities and heightened reliability for industrial applications. Added benefits involve new capabilities in media acceleration to better support video transcode and analytics across live OTT, Video on Demand, and broadcast services, alongside enhancements in Advanced Vector Extensions and Advanced Matrix Extensions for superior inferencing performance.
At a recent demonstration, Intel’s Integrated Photonics Solutions Group unveiled its first fully integrated optical compute interconnect (OCI) chiplet. This chiplet, which was co-packaged with an Intel CPU, successfully ran live data, exhibiting the ability to support 64 channels with each transmitting 32 gigabits of data per second in both directions over up to 100 meters of fiber optics.
This technological advance holds significant promise for enhancing CPU/GPU cluster connectivity and supports innovative computing structures. These include coherent memory expansion and resource disaggregation, crucial for AI infrastructure development within data centers and high performance computing (HPC) environments.
Furthermore, Intel introduced a client product called Lunar Lake, tailored for pioneering AI-enhanced PCs. Lunar Lake, featuring a combination of Performance cores (P-cores) and Efficient-cores (E-cores) along with a new neural processing unit, promises up to a fourfold increase in speed, facilitating notable advancements in generative AI compared to previous models.
Lunar Lake includes a new Xe2 graphics processing unit cores, enhancing gaming and graphics performance by 1.5 times compared to its predecessors.
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